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Features

SIP (Single in-line package) Output voltage programmable from 0.75 Vdc to 3.3 Vdc via external resistor Up to 16 A output current Up to 95 % efficiency Small size, low profile, cost-efficient open frame design Low output ripple and noise
High reliability Remote on/off Remote sense Output overcurrent protection (non-latching) Overtemperature protection Constant switching frequency (300 kHz) Wide operating temperature range Optional sequencing function
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SX(T)16A-3-5SA SIP Non-Isolated Power Module
Description Bourns(R) SX(T)16A-3-5SA is a non-isolated DC-DC converter offering designers a cost and space-efficient solution with standard features such as remote on/off, remote sense, precisely regulated programmable output voltage, overcurrent and overtemperature protection, and optional output voltage sequencing. These modules deliver up to 16 A of output current with full load efficiency of 95 % at 3.3 V output. How to Order
S X (T) 16A - 3-5 S A (-P)
Configuration S = SIP Internal Identifier Identifies Sequencing Pin Function Output Current (Amps) Input Voltage (V) Outputs S = Single Output Voltage (V)* A = Adjustable Optional Positive On/Off Logic *Fixed output voltage parts and optional features available; contact factory.
Absolute Maximum Ratings
Stress in excess of absolute maximum ratings may cause permanent damage to the device. Device reliability may be affected if exposed to absolute maximum ratings for extended time periods.
Characteristic Continuous Input Voltage Operating Temperature Range Storage Temperature Sequencing Function Electrical Specifications Min. -0.3 -40 -55 -0.3 Max. 5.8 +85 +125 Vin, max. Units Vdc C C Vdc See Thermal Considerations section Notes & Conditions
Unless otherwise specified, specifications apply over all input voltage, resistive load and temperature conditions.
Characteristic Operating Input Voltage Maximum Input Current Input No Load Current 25 30 Input Stand-by Current Inrush Transient Input Reflected Ripple Current Input Ripple Rejection 100 30 1.5 0.1 mA mA mA A2s mAp-p dB 120 Hz Min. 2.4 Nom. Max. 5.5 16.0 Units Vdc Adc Notes & Conditions Vout Vin - 0.5 V Over Vin range, Io max, Vout = 3.3 Vdc Vin = 5.0 Vdc, Io = 0 A, mod. enabled, -Vout = 0.75 Vdc -Vout = 3.3 Vdc Vin = 5.0 Vdc, module disabled
Caution: The power modules are not internally fused. An external input line fast acting fuse with a maximum rating of 20 A (glass type, rated to 32V) is required. See the Safety Considerations section of this data sheet.
Applications

Intermediate Bus architecture Distributed power applications Workstations and servers

Telecom equipment Enterprise networks including LANs/WANs Latest generation ICs (DSP, FPGA, ASIC) and microprocessor powered applications
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex. Specifications are subject to change without notice. Customers should verify device performance in their specific applications.
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SX(T)16A-3-5SA SIP Non-Isolated Power Module
Electrical Specifications (Continued)
Characteristic Output Voltage Setpoint Accuracy Output Voltage Tolerance Voltage Adjustment Range Line Regulation Load Regulation Temperature Regulation Output Current Output Current Limit Inception (Hiccup Mode) Output Short Circuit Current Output Ripple and Noise Voltage RMS Peak-to-Peak External Capacitance - ESR 1 m - ESR 10 m Efficiency (Vin = 5 Vdc, TA= 25 C, Full Load) 82.0 87.0 89.0 90.0 92.5 95.0 300 300 25 0.0 200 3.5 8 25 15 50 1000 5000 Min. -2.0 -3.0 0.7525 0.3 0.4 0.4 16.0 Nom. Max. 2.0 3.0 3.63 Units % Vo,set % Vo,set Vdc % Vo,set % Vo,set % Vo,set Adc % Io max Adc mVrms mVpk-pk F F % % % % % % kHz mV s 1 F ceramic/10 F tantalum capacitor Peak Deviation Settling Time (Vo<10 % peak deviation) 3 x 100 F polymer capacitors Peak Deviation Settling Time (Vo<10 % peak deviation) Vo,set = 0.75 Vdc Vo,set = 1.2 Vdc Vo,set = 1.5 Vdc Vo,set = 1.8 Vdc Vo,set = 2.5 Vdc Vo,set = 3.3 Vdc Vo 250 mV - Hiccup Mode 1 F ceramic/10 F tantalum capacitors 5 Hz to 20 MHz bandwidth Notes & Conditions Vin min, Io max, TA = 25 C Over all rated in out voltage, load and temperature conditions
Switching Frequency Dynamic Load Response 8 A to 16 A; 16 A to 8 A; (i/t = 2.5 A/s; 25 C)
8 A to 16 A; 16 A to 8 A; (i/t = 2.5 A/s; 25 C)
150 100
mV s
General Specifications
Characteristic Calculated MTBF Weight Nom. 13,675,000 5.4 (0.19) Units hours g (oz.) Notes & Conditions
2
Specifications are subject to change without notice. Customers should verify device performance in their specific applications.
SX(T)16A-3-5SA SIP Non-Isolated Power Module
Feature Specifications
Characteristic Remote Enable Open = On (Logic Low) Low = Off (Logic High) Turn-On Delay and Rise Times Case 1: On/Off Low - Vin Applied Case 2: Vin Applied, then On/Off Set Low Case 3: Output Voltage Rise Sequencing Delay Time Tracking Accuracy Output Voltage Overshoot Remote Sense Range Overtemperature Protection Input Undervoltage Lockout -Turn-on Threshold -Turn-off Threshold 125 2.2 2.0 10 100 200 200 400 1 0.5 Min. Nom. Max. 0.4 5.5 2.5 2.5 3.0 Units Vdc Vdc msec msec msec msec mV mV % Vo, set Vdc C V V See Thermal Consideration section Notes & Conditions 10 A max. 1 mA max.
>2.5
(10 %-90 % of Vo setting) Delay from Vin, min. to application of voltage on SEQ pin Power Up: 2 V/ms Power Down: 1 V/ms Io max, Vin=5.5, TA=25 C
Specifications are subject to change without notice. Customers should verify device performance in their specific applications.
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SX(T)16A-3-5SA SIP Non-Isolated Power Module
Characteristic Curves The curves provided below are typical characteristics for the SX(T)16A-3-5SA modules at 25 C. For any specific test configurations or any specific test requests, please contact Bourns.
100.0 95.0 Efficiency (%) 90.0 85.0 80.0 75.0 70.0 5.0 10.0 Output Current (A dc) 15.0
Vin=5.5 V Vin=5.0 V Vin=2.4 V
100.0 95.0 Efficiency (%) 90.0 85.0 80.0 75.0 70.0 5.0 10.0 Output Current (A dc)
Vin=5.5 V Vin=5.0 V Vin=2.4 V
15.0
Fig. 1 Efficiency vs. Output Current (Vout = 0.75 Vdc )
Fig. 4 Efficiency vs. Output Current (Vout = 1.8 Vdc )
100.0 Efficiency (%) 95.0 90.0 85.0 80.0 75.0 70.0 5.0 7.0
Efficiency (%)
Vin=5.5 V Vin=5.0 V Vin=2.4 V
100.0 95.0 90.0 85.0 80.0 75.0
Vin=5.5 V Vin=5.0 V Vin=3.0 V
9.0 11.0 13.0 Output Current (A dc)
15.0
70.0 5.0
7.0
9.0 11.0 13.0 Output Current (A dc)
15.0
Fig. 2 Efficiency vs. Output Current (Vout = 1.2 Vdc ) 100.0 Efficiency (%) 95.0 90.0 85.0 80.0 75.0 70.0 5.0 7.0 9.0 11.0 13.0 Output Current (A dc) 15.0
Fig. 5 Efficiency vs. Output Current (Vout = 2.5 Vdc )
Efficiency (%)
Vin=5.5 V Vin=5.0 V Vin=2.4 V
100.0 95.0 90.0 85.0 80.0 75.0 70.0 5.0 7.0
Vin=5.5 V Vin=5.0 V Vin=4.5 V
9.0 11.0 13.0 Output Current (A dc)
15.0
Fig. 3 Efficiency vs. Output Current (Vout = 1.5 Vdc )
Fig. 6 Efficiency vs. Output Current (Vout = 3.3 Vdc )
Specifications are subject to change without notice. Customers should verify device performance in their specific applications.
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SX(T)16A-3-5SA SIP Non-Isolated Power Module
Characteristic Curves (Continued)
Output Voltage (Vdc)
16.0 14.0 12.0 10.0 8.0
Iin, Adc Vo, Vdc
Input Current (A)
6.0 4.0 2.0 0.0 -0.5 0.5 3.5 4.5 1.5 2.5 Input Voltage (Vdc ) 5.5
Output Current Io (5.0 A/div)
Output Voltage Vo (200 mV/div)
18.0
Output Voltage: 200 mVolt 5 s Output Current (5.0 A/Div): 2 Volt 5 s
Time (5 s/div) Fig. 10 Transient Response - 8 A - 16 A Step (Vo = 3.3 Vdc ) Output Voltage Vo (200 mV/div)
Fig. 7 Input Voltage vs. Io and Vo (Vo = 2.5 V, Io= 16.0 A)
Output Voltage Vo (20 mV/div)
?
No Load: 20 mVolt 2.5 s Half Load: 20 mVolt 2.5 s Full Load: 20 mVolt 2.5 s
Output Current Io (5.0 A/div)
Output Voltage: 200 mVolt 5 s Output Current (5.0 A/Div): 2 Volt 5 s
Time (2.5 s/div) Fig. 8 Typical Output Ripple and Noise (V in= 5.0 V, V o = 0.75 V, I o= 16.0 A) Output Voltage Vo (100 mV/div)
Time (5 s/div) Fig. 11 Transient Response - 16 A - 8 A Step (Vo = 3.3 Vdc )
?
Output Voltage Vo (20 mV/div)
?
No Load: 20 mVolt 2.5 s Half Load: 20 mVolt 2.5 s Full Load: 20 mVolt 2.5 s
Output Current Io (5.0 A/div)
Output Voltage: 100 mVolt 10 s Output Current (5.0 A/Div): 2 Volt 10 s
Time (2.5 s/div) Fig. 9 Typical Output Ripple and Noise (Vin = 5.0 V, Vo = 3.3 V, I o = 16.0 A)
Specifications are subject to change without notice. Customers should verify device performance in their specific applications.
Time (10 s/div) Fig. 12 Transient Response - 8 A - 16 A Step (Vo = 3.3 Vdc , Cext = 3x100 F Polymer Capacitors)
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SX(T)16A-3-5SA SIP Non-Isolated Power Module
Characteristic Curves (Continued)
Input Voltage Vin (2 V/div) Output Voltage Vo (0.5 V/div)
Output Current Io (5.0 A/div)
Output Voltage Vo (100 mV/div)
Output Voltage: 100 mVolt 10 s Output Current (5.0 A/Div): 2 Volt 10 s
Output Voltage: 500 mVolt 1 ms On/Off Voltage: 2 Volt 1 ms
Time (10 s/div) Fig. 13 Transient Response - 16 A - 8 A Step (Vo = 3.3 Vdc , Cext = 3x100 F Polymer Capacitors)
Time (1 ms/div) Fig. 16 Typical Start-up with Application of Vin (Vin = 5 Vdc , Vo = 3.3 Vdc , Io = 16 A)
On/Off Voltage Von/off (2 V/div)
Output Voltage Vo (0.5 V/div)
Output Voltage Vo (0.5 V/div)
On/Off Voltage Von/off (2 V/div)
Output Voltage: 500 mVolt 1 ms On/Off Voltage: 2 Volt 1 ms
Output Current: 500 mVolt 1 ms On/Off Voltage: 2 Volt 1 ms
Time (1 ms/div) Fig. 14 Typical Start-up using Remote On/Off (Vin = 5 Vdc, Vo = 3.3 Vdc, Io = 10 A)
Time (1 ms/div) Fig. 17 Typical Start-up using Remote On/Off with Prebias (Vin = 5 Vdc , Vo = 3.3 Vdc , Io = 1 A, Vbias = 1 Vdc )
On/Off Voltage Von/off (2 V/div)
Output Voltage Vo (0.5 V/div)
Output Voltage: 500 mVolt 1 ms On/Off Voltage: 2 Volt 1 ms
Output Current Io (4 A/div)
Output Current (10 A/div): 50 mVolt 5 ms
Time (1 ms/div) Fig. 15 Typical Start-up using Remote On/Off with Low-ESR External Capacitors (100x100 F Polymer) (Vin = 5.0 Vdc , Vo = 3.3 Vdc , Io = 10.0 A, Co = 1000 F)
Time (5 ms/div) Fig. 18 Output Short Circuit Current (Vin = 5.0 Vdc , Vo = 0.75 Vdc )
Specifications are subject to change without notice. Customers should verify device performance in their specific applications.
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SX(T)16A-3-5SA SIP Non-Isolated Power Module
Characteristic Curves (Continued)
18 16 14 12 10 8 6 4 2 0 15 18 16 14 12 10 8 6 4 2 0 15
Output Current (A)
0 LFM 100 LFM 200 LFM 300 LFM 400 LFM
Output Current (A)
0 LFM 100 LFM 200 LFM 300 LFM 400 LFM
25
35 45 55 65 75 Ambient Temperature (C)
85
25
35 45 55 65 75 Ambient Temperature (C)
85
Fig. 19 Derating Output Current vs. Local Ambient Temp. and Airflow (Vin = 5.0 Vdc , Vo = 3.3 Vdc ) 18 16 14 12 10 8 6 4 2 0 15
Fig. 22 Derating Output Current vs. Local Ambient Temp. and Airflow (Vin = 3.3 Vdc , V o = 0.75 Vdc )
Output Current (A)
0 LFM 100 LFM 200 LFM 300 LFM 400 LFM
25
35 45 55 65 75 Ambient Temperature (C)
85
Fig. 20 Derating Output Current vs. Local Ambient Temp. and Airflow (Vin = 5.0 Vdc , Vo = 0.75 Vdc )
18 16 14 12 10 8 6 4 2 0 15
Output Current (A)
0 LFM 100 LFM 200 LFM
25
35 45 55 65 Ambient Temperature (C)
75
85
Fig. 21 Derating Output Current vs. Local Ambient Temp. and Airflow (Vin = 3.3 Vdc , Vo = 2.5 Vdc )
Specifications are subject to change without notice. Customers should verify device performance in their specific applications.
7
SX(T)16A-3-5SA SIP Non-Isolated Power Module
Operating Information Remote On/Off The SX(T)16A-3-5SA comes standard with Active LOW Negative On/Off logic, i.e., OPEN or LOW (< 0.4 V) will turn ON the device. To turn the device OFF, increase the voltage level on the On/Off pin above 2.4 V, as shown in Figure 23, placing the part into low dissipation sleep mode. The SX(T)16A-3-5SA-P comes with Active HIGH Positive On/Off logic, i.e., OPEN or HIGH (>2.4 V) will turn on the device. To turn OFF, decrease the voltage level on the On/Off pin below 0.4 V. The signal levels of the On/Off pin input is defined with respect to ground.
SX(T)16A-3-5SA-P SX(T)16A-3-5SA
Fig. 23 Circuit Configuration for using Negative Logic On/Off
Fig. 24 Circuit Configuration for using Positive On/Off
Input Considerations The input must have a stable low impedance AC source for optimum performance. This can be accomplished with external ceramic capacitors, tantalum capacitors and/or polymer capacitors. Using low impedance tantalum capacitors requires about 20 F per amp and an ESR of 250 m per amp of output current. Tantalum capacitors with a combined value of 300 F and less than 15m ESR would be adequate. This can be implemented with (3) 100 F tantalum capacitors with an ESR less than of 40m. Ceramic capacitors are also recommended to reduce high frequency ripple on the input. Output Considerations To maintain the specified output ripple and transient response, external capacitors must be used. An external 1 F ceramic capacitor in parallel with a 10 F low ESR tantalum capacitor will usually meet the specified performance. Improved performance can be achieved by using more capacitance. Low ESR polymer capacitors may also be used. Two 100 F, 9 m or lower ESR capacitors are recommended. Safety Information In order to comply with safety requirements the user must provide a fuse in the unearthed input line. This is to prevent earth being disconnected in the event of a failure. The converter must be installed as per guidelines outlined by the various safety approvals if safety agency approval is required for the overall system. The positive input lead must be provided with a fact acting fuse with a maximum rating of 20 A (glass type, rated to 32 V). Overtemperature Protection The device will shut down if it becomes too hot (typically 125 C). Once the converter cools, it automatically restarts. This feature does not guarantee the converter won't be damaged by temperatures above its rating.
8
Specifications are subject to change without notice. Customers should verify device performance in their specific applications.
SX(T)16A-3-5SA SIP Non-Isolated Power Module
Operating Information (Continued) Overcurrent Protection The device has an internally set output current limit to protect it from overloads, placing the unit in hiccup mode. Once the overload is removed the converter automatically resumes normal operation. No user adjustments are available. An external fuse in series with the input voltage is also required for complete overload protection. Input Undervoltage Lockout The device operation is disabled if the input voltage drops below the specified input range. Once the input returns to the specified range operation automatically resumes. No user adjustments are available. Output Voltage Setting The output voltage can be programmed to any voltage between 0.75 Vdc and 3.3 Vdc by connecting a single resistor between the trim pin and the GND pin of the module, as shown in Fig. 25 below. If left open circuit the output voltage will default to 0.75 Vdc. The correct Rtrim value for a specific voltage can be calculated using the following equation: Rtrim = [21.07/(Vo-0.7525)-5.11] K For example, to set the SX(T)16A-3-5SA to 3.3 V the following Rtrim resistor must be used: Rtrim = [21.07/(3.3-0.7525)-5.11] K Rtrim = 3.161 k, The closest standard 1 % E96 value is 3.16 k. Table 1 provides the Rtrim values required for some common output voltage set points. The nearest standard E96 1 % resistor value is also given.
VIN (+) VO (+)
ON/OFF
TRIM Rtrim
LOAD
GND
Fig. 25 Circuit Configuration to Program Output Voltage using an External Resistor
Vo (V) 0.75 1.0 1.2 1.5 1.8 2.0 2.5 3.3
SX(T)16A-3-5SA Rtrim Values Rtrim (k) 1 % Value Open Open 80.02 80.6 41.97 42.2 23.08 23.2 15.00 15.0 11.78 11.8 6.947 6.98 3.161 3.16
Table 1 The output voltage of the device can also be set by applying a voltage between the TRIM and GND pins. The Vtrim equation can be written as follows: Vtrim = (0.7 - 0.1698 x{Vo - 0.7225)) To set Vo = 3.3 V, the Vtrim required would therefore be 0.2670 V. Table 2 provides the Vtrim values required for some common output voltage set points.
Specifications are subject to change without notice. Customers should verify device performance in their specific applications.
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SX(T)16A-3-5SA SIP Non-Isolated Power Module
Operating Information (Continued)
SX(T)16A-3-5SA Vtrim Values Vo (V) Vtrim (V) 0.75 Open 1.0 0.6580 1.2 0.6240 1.5 0.5731 1.8 0.5221 2.0 0.4882 2.5 0.4033 3.3 0.2674
Table 2 Voltage Margining Output voltage margining can be implemented as follows and as shown in Figure 26. 1) Trim-up: Connect a resistor, Rm-up, from the Trim pin to the ground pin for adjusting the voltage upwards, and 2) Trim-down: Connect a resistor, Rm-down, from the Trim pin to the output pin for adjusting the voltage downwards. Please consult your local Bourns field applications engineer for more details and the calculation of the required resistor values.
Vo Vo Vin Rmargin-down Q2 On/Off Trim Rmargin-up Rtrim Q1 COM
Fig. 26 Circuit Configuration for Margining Output Voltage Sequencing Function Bourns XT Series modules have a sequencing feature that enables users to implement various types of output voltage sequencing in their applications. When an analog voltage is applied to the SEQ pin, the output voltage tracks this voltage until the output reaches the set-point voltage. The final SEQ pin voltage must be set higher than the set-point voltage of the module. The output voltage follows the voltage on the SEQ pin on a one-to-one basis. By connecting multiple modules together, customers can get multiple modules to track their output voltages to the voltage applied on the SEQ pin. For proper voltage sequencing, the input voltage is applied to the module. The On/Off pin should be set so as the module is ON by default. An analog voltage is applied to the SEQ pin and the output voltage of the module will track this voltage on a 1:1 basis until output reaches the set-point voltage, as shown in Figure 27. To initiate simultaneous shutdown of the modules, the SEQ pin voltage is lowered in a controlled manner. Output voltage of the modules tracks the voltages below their set-point voltages on a one-to-one basis, as shown in Figure 28. A valid input voltage must be maintained until the tracking and output voltages reach ground potential to ensure a controlled shutdown of the modules. When not using the sequencing feature, tie the SEQ pin to Vout. For additional guidelines please contact your local Bourns field applications engineer.
Specifications are subject to change without notice. Customers should verify device performance in their specific applications.
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SX(T)16A-3-5SA SIP Non-Isolated Power Module
Operating Information (Continued)
Output Voltage Sequencing Voltage Vo (0.5 V/div) V seq (0.5 V/div) Output Voltage Sequencing Voltage V seq (0.5 V/div) Vo (0.5 V/div)
Vo: 1 Volt 500 s Vseq: 1 Volt 500 s
Vo: 1 Volt 1 ms Vseq: 1 Volt 1 ms
Time (0.5 ms/div) Fig. 27 Voltage Sequencing at Power Up (V in = 5.0 Vdc, Vo = 3.3 Vdc, Io = 16.0 A)
Time (0.5 ms/div) Fig. 28 Voltage Sequencing at Power Down (V in = 5.0 Vdc, Vo = 3.3 Vdc, Io = 16.0 A)
Remote Sense The Remote Sense feature is used to minimize the effects of distribution losses by regulating the voltage at the Remote Sense pin (See Figure 29). The voltage between the Sense pin and Vo pin must not exceed 0.5 V. When the Remote Sense feature is not being used, connect the Remote Sense pin to the output pin of the module. It is very important to make sure that the maximum output power (Vo x Io) of the module remains less than or equal to the maximum rated power. Using Remote Sense, the output voltage of the module can increase, which may increase the power output by the module.
Rdistribution Rcontact VIN(+) Vo Rcontact Rdistribution
Sense RLOAD Rdistribution Rcontact COM Rcontact Rdistribution
Fig. 29 Remote Sense Circuit Configuration
Thermal Considerations Sufficient cooling must always be considered to ensure reliable operation, as these devices operate in a variety of thermal environments. Factors such as ambient temperature, airflow, power dissipation and reliability must be taken into consideration. The data presented in Figures 19 to 23 is based on physical test results taken in a wind tunnel test. The test set-up is shown in Figure 31. The thermal reference points are (1) Tref1 and Tref2 as shown in Figure 30, and (2) Tref3 = temperature at controller IC. For reliable operation, none of these Tref points should exceed 115 C.
Specifications are subject to change without notice. Customers should verify device performance in their specific applications.
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SX(T)16A-3-5SA SIP Non-Isolated Power Module
Thermal Considerations (Continued)
Air Flow
WIND TUNNEL Airflow and ambient temp sensor probes location
Air Flow
Tref1
Q1
Tref2
C4 C3 C2 C1
L1
Q2 C2 C1 UNIT UNDER TEST
PCB
Fig. 30 Tref1 Temperature Measurement Location
Fig. 31 Thermal Test Set-up
Product Dimensions
FRONT VIEW OF BOARD (INDUCTOR SIDE)
50.8 (2.00) 7.43 MAX. (0.293)
SIDE VIEW
6.96 REF. (0.274)
DIMENSIONS: MM (INCHES)
12.7 (0.50)
12.32 (0.485)
1 2 3 4 5 6 7 8 B* 9 10
11 PINS 0.64 0.38 X (0.025) (0.015)
L1 (REF.)
TOLERANCES: 0.5 (0.02) 0.25 DECIMAL .XX (0.010) DECIMAL .X
0.64 (0.025) 6.32 (0.249)
7.6 (0.30) 1.28 (0.050) 2.54 (0.100) 5.08 (0.200) 7.62 (0.300) 10.16 (0.400) 35.56 (1.400) 38.10 (1.500) 40.64 (1.600) 43.18 (1.700) 45.72 (1.800) 48.26 (1.900)
PIN 1 2 3 4 5 6 7 8 B (optional) 9 10
FUNCTION VOUT VOUT SENSE VOUT GND GND VIN VIN SEQ TRIM ON/OFF
*Pin Stuffed with SXT16A option only, absent with SX16A standard
Fig. 32 Product Dimensions
Specifications are subject to change without notice. Customers should verify device performance in their specific applications.
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SX(T)16A-3-5SA SIP Non-Isolated Power Module
Recommended Hole Pattern
48.26 (1.900) 45.72 (1.800) 43.18 (1.700) 40.64 (1.600) 38.10 (1.500) 10.16 (0.400) 7.62 (0.300) 5.08 (0.200) 2.54 (0.100) 1.27 (0.050)
1 2 3 4 5 6 7 8 B* 9 10
35.56 (1.400)
DIMENSIONS: MM (INCHES)
1.3 (0.05)
7.9 (0.31)
1.09 (0.043) THROUGH-HOLE PLATED 1.63 (0.064) BOTH SIDES PAD SIZE *Hole required with SXT16A option only, not required with SX16A standard 50.8 (2.00)
OUTLINE AREA
Fig. 33 Recommended Hole Pattern
Asia-Pacific: Tel: +886-2 2562-4117 * Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 * Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 * Fax: +1-951 781-5700 www.bourns.com
LONGFORM REV. A 06/06
Specifications are subject to change without notice. Customers should verify device performance in their specific applications.
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